> I think everyone's focusing on the core count, but the packaging story is way more interesting here. This thing is 12 separate chiplets on 18A stacked on base dies made on Intel 3, connected to I/O tiles on Intel 7. Three different process nodes in one package, shipping at volume. That's nuts. https://www.tomshardware.com/pc-components/cpus/intels-make-or-break-18a-process-node-debuts-for-data-center-with-288-core-xeon-6-cpu-multi-chip-monster-sports-12-channels-of-ddr5-8000-foveros-direct-3d-packaging-tech